Specifications:
	Layers: 1 to 48
	Board finished thickness: 0.21 to 7.0mm
	Materials: FR-4, CEM-1, CEM-3, high TG, FR4 halogen free,Rogers
	Maximum finished board size: 23 x 25mm (580 x 900mm)
	Minimum drilled hole size: 3 mils (0.075mm)
	Minimum line width: 3 mils (0.075mm)
	Minimum line spacing: 3 mils (0.075mm)
	Size: 243.4 x 244.43mm
	Surface finishing/treatment: HASL/HASL lead-free, HAL, chemicaltin, chemical gold,
	immersion silver/gold, OSP, gold plating
	Copper thickness: 0.5 to 7.0oz
	Solder mask colors: green, yellow, black, white, red, blue
	Copper thickness in hole: >25.0µm (>1 mil)
	Packing:
	Inner packing: vacuum packing/plastic bag
	Outer packing: standard carton packing
	Shape tolerance: ±0.13
	Hole tolerance:
	PTH: ±0.076
	NPTH: ±0.05
	With UL, SGS and RoHS marks
	Special requirements: buried and blind via + controlledimpedance + BGA
	Profiling: punching, routing, V-cut, beveling
	Testing procedure:
	Visual inspection
	Flying probe
	Impedance control
	Solder-ability detection
	Digital metallographic microscope
	AOI (automated optical inspection)
	 
	Services:
	No MOQ
	Provide OEM services
	Multilayer PCB sample: 6-10 days, mass production: within 15 days
	Double-sided PCB sample: 3-5 days, mass production: within10 days
	Shipping methods: DHL, UPS, FedEx, TNT forwarder
            
        
            
                
                                
                
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                                                                4 layer Rigid-flex PCB with Stiffener, FR4 and PI Material Images
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